Sony has introduced a fascinating update to the PlayStation 5 Pro, one that’s stirred up some quiet excitement: a notable change in the design of its heatsink. The YouTube channel TronicsFix, known for console repairs, recently explored this and found that the PS5 Pro’s heatsink moves away from the traditional smooth finish, opting instead for a surface decorated with a rectangular spiral pattern.
In a video analysis, TronicsFix suggests that this pattern was purposefully engineered to address a couple of issues linked to the use of liquid metal thermal interface material (TIM). Typically, liquid metal can spread unevenly, pooling unpredictably and risking surface oxidation. The grooves in the heatsink of the PS5 Pro likely help manage these concerns by reducing the occurrence of dry spots and perhaps even slightly enlarging the contact surface area.
For those familiar with how liquid metal behaves, you’ll know it tends to be tricky to spread consistently. Unlike conventional thermal pastes, liquid metal is notorious for flowing into areas you wouldn’t want it to. To prevent this electrically conductive material from leaking and potentially damaging other components, manufacturers often integrate seals or barriers around the heatsink designed for liquid metal.
Interestingly, TronicsFix also notes that the way liquid metal moves can be further complicated if the PS5 is used while standing vertically, a positioning that many users prefer. Given TronicsFix’s extensive experience in repairing and fine-tuning PS5s, their insights are likely quite accurate.
This design choice by Sony, using rectangular spiral grooves on the heatsink that interfaces with AMD’s APU, challenges some conventional cooling approaches. Traditionally, extreme overclockers and tech enthusiasts spend a lot of time ensuring that both the processor and heatsink surfaces are as flat and polished as possible for optimal thermal conductivity. However, liquid metal has shifted these conventions. Surely, Sony conducted rigorous testing contrasting the new heatsink design against a traditional smooth one, concluding that the spiral grooves offered enough of a thermal advantage to justify the change.
With the PS5 Pro showcasing enhanced processing capability, especially with its upgraded GPU, it’s reasonable to deduce that these heatsink grooves play a critical role in preventing thermal throttling.
The PS5 Pro made its public debut in September, but only reached consumers this month. As enthusiasts and experts continue to dismantle and examine the console’s design, more revelations come to light. Fortunately, during its launch, lead architect Mark Cerny offered deep insights into most of the technical details, providing a greater understanding of Sony’s engineering strategies.
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